According to the Fraunhofer IPMS product classification a demonstrator (or A-Sample) is characterized by one or all of the following items:
|Demonstrator / A-Sample|
|Customer Usage||The application is for the investigation of functionality.|
The Fraunhofer IPMS VarioS®-Microscanner-configurator can be used to parameterize the following types of demonstrators:
Customers interested in receiving VarioS®-Microscanner-demonstrators are asked to send a request for quotation. For this the VarioS®-Microscanner-configurator's built-in email form can be used. Alternatively an email can be sent via the customer service email form. Price information for our demonstrators is found here.
|Mirror Motion||harmonic oscillation|
|Scan Frequencies||depending on configuration type and design parameters 100 Hz ... 50 kHz|
|Drive Signal||A square wave voltage input signal is required which can be generated with standard laboratory equipment
- a power supply unit is not in the standard scope of delivery with VarioS®-Microscanner-demonstrators.
1D- VarioS®-Microscanner-demonstrators can be delivered in a modular system as an option.
Alternatively customer-specific drive electronics and system designs can be delivered as result of a research and development project from Fraunhofer IPMS.
|Amplitude||up to ±29° maximum mechanical deflection, amplitude controllable via electrode voltage and input pulse frequency|
|Drive||planar comb electrodes with out-of-plane motion|
|2D Axis Configuration||gimballed|
|Position Sensors||no position sensor integrated|
|Mirror Diameter / 1D-Microscanner||0.5 ... 3 mm|
|Mirror Diameter / 2D-Microscanner||0.5 ... 2 mm|
|Mirror Reflectance||dependent on wavelength of light source, approx. 80-92% (see Fig. 1) for visible range|
|Chip Dimensions||5370 µm × 4540 µm|
|Substrate||Bonded Silicon on Insulator (BSOI), stack:
|Fabrication Process||bulk silicon MOEMS process (AME75).
Fabrication is performed at the facilities of Fraunhofer IPMS.
|Chip Housing/Protection||DIL14 with visible range
broadband ARC glass cover (see Fig.2).
|Option available: Modular System with die on carrier pcb and sealed housing|
|Parametric Mirror Excitation||Operation principle is based on parametric resonance.
Therefore the system will start spontaneous oscillation within a specific range of drive voltage and repetition rate.
|Static Deformation||mirror plate radius of curvature typically > 5 m|
|Dynamic Deformation||Mirror mass inertia leads to dynamic deformation of the mirror plate.
Mirror dynamic deformation scales linearly with mirror deflection (see Fig.4).
Mirror dynamic deformation typically is characterized by the root mean square (RMS) of the deflection field in respect to the ideal plane mirror plate.
© 2019 Fraunhofer IPMS
last modified : 2019-06-26