Information on VarioS®-Microscanner-Demonstrators

What is a Demonstrator?

According to the Fraunhofer IPMS product classification a demonstrator (or A-Sample) is characterized by one or all of the following items:

Demonstrator / A-Sample
Customer Usage The application is for the investigation of functionality.
Development Status
  • project, not yet fully developed
  • some functions not fully characterized
  • basis for specification with shortened development
  • preseries production is not assured

The Fraunhofer IPMS VarioS®-Microscanner-configurator can be used to parameterize the following types of demonstrators:

Customers interested in receiving VarioS®-Microscanner-demonstrators are asked to send a request for quotation. For this the VarioS®-Microscanner-configurator's built-in email form can be used. Alternatively an email can be sent via the customer service email form. Price information for our demonstrators is found here.

Technical Properties
Mirror Motion harmonic oscillation
Scan Frequencies depending on configuration type and design parameters 100 Hz ... 50 kHz
Drive Signal A square wave voltage input signal is required which can be generated with standard laboratory equipment - a power supply unit is not in the standard scope of delivery with VarioS®-Microscanner-demonstrators. 1D- VarioS®-Microscanner-demonstrators can be delivered in a modular system as an option.
Alternatively customer-specific drive electronics and system designs can be delivered as result of a research and development project from Fraunhofer IPMS.
Amplitude up to ±29° maximum mechanical deflection, amplitude controllable via electrode voltage and input pulse frequency
Mechanical Scan Angle
Drive Mode electrostatic-resonant
Drive planar comb electrodes with out-of-plane motion
2D Axis Configuration gimballed
Position Sensors no position sensor integrated
Mirror Shape circular
Mirror Diameter / 1D-Microscanner 0.5 ... 3 mm
Mirror Diameter / 2D-Microscanner 0.5 ... 2 mm
Mirror Reflectance dependent on wavelength of light source, approx. 80-92% (see Fig. 1) for visible range
Chip Dimensions 5370 µm × 4540 µm
Reflectivity Fig 1: Typical reflectance curve of aluminum mirror coating in relation to wavelength of light source
Substrate Bonded Silicon on Insulator (BSOI), stack:
  • silicon, device layer [75 µm]
  • silicon dioxide, insulation layer [1 µm]
  • silicon, handling layer [400 µm]
Fabrication Process bulk silicon MOEMS process (AME75).
Fabrication is performed at the facilities of Fraunhofer IPMS.
  • mirror plate and mechanics: single crystalline silicon (c-Si)
  • electrical insulation: silicon dioxide (SiO2)
  • mirror reflective coating: aluminum (Al)
Chip Housing/Protection DIL14 with visible range
broadband ARC glass cover (see Fig.2).
Option available: Modular System with die on carrier pcb and sealed housing
Transmission Fig 2: Transmission of the broadband ARC glass cover at normal incidence angle NIR-Transmission Fig 3: Transmission of the NIR ARC glass cover at normal incidence angle
Additional Properties
Parametric Mirror Excitation Operation principle is based on parametric resonance.
Therefore the system will start spontaneous oscillation within a specific range of drive voltage and repetition rate.
Static Deformation mirror plate radius of curvature typically > 5 m
Dynamic Deformation Mirror mass inertia leads to dynamic deformation of the mirror plate. Mirror dynamic deformation scales linearly with mirror deflection (see Fig.4).
Mirror dynamic deformation typically is characterized by the root mean square (RMS) of the deflection field in respect to the ideal plane mirror plate.
dyn.Deformation Fig 4: Cross sectional scheme of deformed mirror plate. - During operation inertia forces cause the mirror plate to bend. The bending of the mirror plate is described by a local deflection δ0 with respect to the undeformed mirror plate. To provide a measure of the mirror's dynamic deformation the root mean square (RMS) of the deflection field is calculated.
Scope of Delivery for VarioS®-Microscanner-Demonstrators
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© 2018 Fraunhofer IPMS
last modified : 2018-06-26